Ukusebenzisa i-Hot Air Rework Station yokulungisa i-PCB

Iziteshi zomoya ezifudumeleyo zisebenza ngethuluzi eliwusizo kakhulu lapho ukwakha ama-PCB. Ngokuvamile umklamo webhodi uzoba ophelele futhi ngokuvamile ama-chips nezinsimbi kudingeka zisuswe futhi zishintshwe ngesikhathi senqubo yokuxazulula inkinga. Ukuzama ukususa i-IC ngaphandle kokulimala cishe akunakwenzeka ngaphandle kwesiteshi esishisayo somoya. Lezi zeluleko namaqhinga wokuvuselela umoya oshisayo kuzokwenza ukuthi izinto zenzeke futhi ama-IC alula kakhulu.

Amathuluzi Okunene

Ukuvuselelwa kwe-solder kudinga amathuluzi ambalwa ngaphezu nangaphezulu kokusetha okuyisisekelo. Ukuvuselelwa okuyisisekelo kungenziwa ngamathuluzi ambalwa kuphela, kodwa ngama-chips amakhulu, futhi izinga eliphezulu lokuphumelela (ngaphandle kokulimaza ibhodi) amathuluzi ambalwa engeziwe atuswa kakhulu. Amathuluzi ayisisekelo yilena :

  1. Isiteshi se-rework se-hot air solder (ukushisa okuguquguqukayo nokulawula ukugeleza kwe-air kubalulekile)
  2. I-Solder wick
  3. I-solder unamathisele (wokuxazulula)
  4. I-Solder flux
  5. I-soldering iron (ene-adjustable temperature control)
  6. Ama-Tweezers

Ukuze wenze lula kabusha i-solder, amathuluzi alandelayo nawo ayasiza kakhulu:

  1. Ukufudumala kwe-breathe emoyeni okunamathiselwe (okuqondile kuma-chips azosuswa)
  2. I-Chip-Quik
  3. I-Hot Plate
  4. Stereomicroscope

Ukulungiswa kwe-Resoldering

Ukuze isakhi sokuthengiswa ku-pads efanayo lapho ingxenye isanda kususwa kudinga ukulungiswa okuncane ukuze i-soldering isebenze okokuqala. Ngokuvamile isamba esikhulu se-solder sishiywe emaphethini we-PCB okuyinto uma kushiywe emaphethini kugcina i-IC iphakanyisiwe futhi ingavimbela zonke izikhonkwane ekubeni zidayiswe ngendlela efanele. Futhi uma i-IC ine-pad engaphakathi phakathi kwe-solder nayo ingakwazi ukuphakamisa i-IC noma idale kanzima ukulungisa amabhuloho we-solder uma iphuma lapho i-IC icindezela phezulu. Amapayipi angahlanzwa futhi ahanjiswe ngokushesha ngokudlulisa i-solder free soldering iron phezu kwabo futhi asuse i-solder eyengeziwe.

Umvuzo

Kunezindlela ezimbalwa zokususa ngokushesha i-IC usebenzisa isiteshi esiphezulu se-rework esiteshini. Okuyisisekelo kunazo zonke, futhi okunye okulula ukusebenzisa, amasu ukufaka umoya oshisayo kuleso sigaba besebenzisa ukujikeleza okuyi-circular ukuze i-solder kuzo zonke izingxenye zigcwale ngesikhathi esifanayo. Uma i-solder iyancibilika, ingxenye ingasuswa nge-pair of tweezers.

Enye indlela, ewusizo ikakhulukazi kuma-IC amaningi amakhulu ukusebenzisa i-Chip-Quik, i-solder ephansi kakhulu yokushisa eyancibilika ekushiseni okuphansi kakhulu kune-solder ejwayelekile. Uma kucibilikiswa nge-solder ejwayelekile baxuba futhi i-solder ihlala isetshenziselwa uketshezi lwamasekhondi ambalwa anika isikhathi esiningi sokususa i-IC.

Enye inqubo yokususa i-IC iqala ngokuzicabangela noma yiziphi izikhonkwane ingxenye eyinayo. Ukuchofoza zonke izikhonkwane kuvumela i-IC ukuba isuswe futhi noma umoya oshisayo noma insimbi yokuxubha iyakwazi ukususa izinsalela zezikhonkwane.

Izingozi ze-Solder Rework

Ukusebenzisa isiteshi esishisayo se-airder rework ukususa izingxenye akuyona ingozi ngokuphelele. Izinto ezivame kakhulu ezingalungile yizi:

  1. Ukulimaza izingxenye eziseduze - Azikho zonke izingxenye ezingakwazi ukumelana nokushisa okudingekayo ekukhipheni i-IC esikhathini esingasithatha ukuze uncibilikise i-solder kwi-IC. Ukusebenzisa izihlangu zokushisa ezifana ne-aluminium foil kungasiza ekuvimbeleni umonakalo oseduze yizingxenye.
  2. Ukulimaza ibhodi le-PCB - Uma isibhamu somoya esishisayo sigxiliwe isikhathi eside ukushisa iphini elikhulu noma ukudonsa i-PCB ingashisa kakhulu futhi iqale ukuhlanza. Indlela engcono kakhulu yokugwema lokhu ukushisa izingxenye kancane kancane ukuze ibhodi elizungezile libe nesikhathi esengeziwe sokulungisa ushintsho lokushisa (noma ukushisa indawo enkulu ebhodini ngokunyakaza okuyisimungulu). Ukushisa i-PCB ngokushesha kakhulu kufana nokwehlisa i-cube eqhwa egumbini lamanzi elifudumele - gwema ukucindezeleka okusheshayo okusheshayo lapho kunokwenzeka.